The Pulse
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Accelerating Post-Quantum Cryptography via LLM-Driven Hardware-Software Co-Design
2026-02-12T16:39:00+00:00
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Scaling AI from Edge to Data Center with SiFive RISC-V Vectors
2026-02-12T06:56:13+00:00
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RISC-V Pivots from Academia to Industrial Heavyweight
2026-02-12T06:17:00+00:00
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Arteris Technology Deployed More Broadly by NXP to Accelerate Edge AI Leadership
2026-02-12T05:52:00+00:00
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Leadership in CAN XL strengthens Bosch’s position in vehicle communication
2026-02-11T12:11:21+00:00
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Validating UPLI Protocol Across Topologies with Cadence UALink VIP
2026-02-11T11:58:46+00:00
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Cadence Tapes Out 32GT/s UCIe IP Subsystem on Samsung 4nm Technology
2026-02-11T11:38:00+00:00
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Avalanche Technology and NHanced Semiconductors Deliver the Industry’s First Truly Space Grade MRAM Boot Solution for RadHard System-in-Package Integration
2026-02-11T10:07:00+00:00
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Marvell Completes Acquisition of XConn Technologies
2026-02-11T09:11:05+00:00
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IFV: Information Flow Verification at the Pre-silicon Stage Utilizing Static-Formal Methodology
2026-02-11T08:27:07+00:00
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LPDDR6 vs. LPDDR5 and LPDDR5X: What’s the Difference?
2026-02-11T07:27:54+00:00
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Rambus Announces Departure of Chief Financial Officer
2026-02-11T07:21:04+00:00
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DEEPX, Rambus, and Samsung Foundry Collaborate to Enable Efficient Edge Inferencing Applications
2026-02-11T07:10:00+00:00
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AI Elevates Production Management’s Importance in the ASIC Value Chain
2026-02-10T14:29:00+00:00
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Cadence Unleashes ChipStack AI Super Agent, Pioneering a New Frontier in Chip Design and Verification
2026-02-10T14:17:00+00:00
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Faraday Reports Fourth Quarter 2025 Results
2026-02-10T13:48:00+00:00
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Passing the Torch: Reflections on ARC’s Journey and the Future of Specialized Processing
2026-02-10T13:19:50+00:00
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Google’s High-Speed Interconnect Architecture to Push 800G+ Optical Transceiver Share Past 60% by 2026, Says TrendForce
2026-02-10T12:47:00+00:00
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Ceva Wi-Fi 6 and Bluetooth IPs Power Renesas’ First Combo MCUs for IoT and Connected Home
2026-02-10T12:34:21+00:00
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CES 2026 Recap: Trust Built on a Real, Working eUSB2V2 System Demo
2026-02-10T08:54:00+00:00
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TES offers a programmable precision DC voltage amplifier IP for X-FAB’s XT018 technology
2026-02-10T08:35:52+00:00
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System-Level Isolation for Mixed-Criticality RISC-V SoCs: A "World" Reality Check
2026-02-10T07:57:19+00:00
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CVA6-CFI: A First Glance at RISC-V Control-Flow Integrity Extensions
2026-02-10T07:30:00+00:00
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Amid rising cyber threats, EnSilica joins the CHERI Alliance to enable safe & secure silicon
2026-02-10T07:12:16+00:00
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TSMC 3-nm Upgrade in Japan to Catch up With Demand
2026-02-10T07:06:26+00:00
The Semiconductor IP Marketplace that puts you first
Semi IP Hub's mission is to provide you with a platform where you can find Silicon IP cores for your next project without being harassed by dozens of sellers.
Here, your contact details are not shared with third parties unless you request to be contacted by a supplier.
Spotlight
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HiFi iQ DSP
- 8X Increased AI Performance: Run the entire voice AI networks efficiently with configurable AI-MAC
- 2X Increased Raw Compute Performance: Wider SIMD allows more computations
- Expanded Data Type Support: Efficiently run cutting-edge voice AI models in FP8, BF16, and more
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CXL 4 Verification IP
- Compliant with the CXL 4, 3.2, 2.0 & 1.1 Specifications.
- Support for all three protocols CXL.IO, CXL.CACHE & CXL.MEM including all CXL device types
- Support for PCIE Mode & Alternate Protocol Negotiation for CXL Mode
- Support for 256B flit in 128GT/s with PCIe Gen 6 as well as 64/32/16/8 GT/s speeds with backward compatibility.
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Analog I/O Library with a custom 12V ESD Solution IN GF 55nm
- This I/O library is a silicon-proven, flip-chip-optimized analog and mixed-signal I/O Library for GlobalFoundries 55nm BCD technology.
- It provides a comprehensive set of 1.8V, 3.3V, 5V, and 12V analog I/O and power pads, designed for robust ESD protection, flexible pad-ring construction, and reliable operation across industrial temperature ranges.
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JESD204E Controller IP
- The JESD204E Controller IP from Chip Interfaces is an early adopter’s version of the upcoming revision of the JEDEC standard for Serial Interface for Data Converters.
- The JESD204-E IP core supports the UCIe Optimized Link Layer, a dedicated mode to run JESD over UCIe Modules with Line rates up the 64Gbps per bump, and a JESD204D backwards compatible mode called the Unified Link Layer with line speeds up to 116Gbps with PAM4 and 58Gbps with NRZ and full FEC support.
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HPC MACsec Security Modules for Ethernet
- IEEE 802.1ae, IEEE 802.1br Support
- 100 Gbps—1.6 Tbps
- Can reach higher throughputs scalable to 3.2 Tbps
- Supports also lower performance modes down to 10 Gbps
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eUSB2V1.2 Controller + PHY IP
- eUSB2 can support USB high-speed, full-speed, and low-speed operation, as well as the USB 2.0 L1/L2 link power management requirements. In addition, eUSB2 requires no change to the existing USB 2.0 software programming model.
- eUSB2 also uses the same two data line configurations, eD+ and eD- as USB2 D+ and D-. Vbus and power delivery are not impacted by eUSB2.
UCIe Controller IP View All
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UCIe Die-to-Die Chiplet Controller
- High configurability and customizability
- Defines packets to communicate with a link partner using different AXI parameters
- Supports raw streaming modes
- Provides various Flit formats in UCIe v1.1 (filt format 2: 68B flit format, flit format 3/4: standard 256B flit format, and flit format 5/6: latency optimized 256B flit format)
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UCIe PHY & D2D Adapter
- 32Gbps UCIe-Advanced (UCIe-A) & Standard (UCIe-S)
- UCIe v1.1 specification
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TSMC CLN5FF GUCIe LP Die-to-Die PHY
- IGAD2DY11A is an LP (Low Power) Die-to-Die (D2D) PHY for SoIC-X Face-to-Face advanced package.
- This GUCIe PHY not only supports UCIe specification rev 1.1 compliance physical layer and Raw D2D interface (RDI) but also optionally provides the
PCIe 7.0 IP View All
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PCIe 7.0 Controller with AXI
- Optimized for high-bandwidth efficiency at data rates up to 128 GT/s
- Separate native TX/RX data path separating posted/Non posted/completion traffic
- Handles up to 4 TLPs per cycle
- Advanced PIPE modes and port bifurcation
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PCIe 7.0 PHY IP
- Physical Coding Sublayer (PCS) block with PIPE interface
- Supports PCIe 7.0, encoding, backchannel initialization
- Lane margining at the receiver
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PCIe 7.0 PHY in TSMC (N5, N3P)
- Physical Coding Sublayer (PCS) block with PIPE interface
- Supports PCIe 7.0, encoding, backchannel initialization
- Lane margining at the receiver
- Spread-spectrum clocking (SSC)
AI IP View All
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RISC-V CPU IP
- RISC-V RVA23 Compliant
- >18 SPECint2006/GHz
- 8-wide decode unit
- Advanced branch predictor
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NPU IP for Embedded ML
- Fully programmable to efficiently execute Neural Networks, feature extraction, signal processing, audio and control code
- Scalable performance by design to meet wide range of use cases with MAC configurations with up to 64 int8 (native 128 of 4x8) MACs per cycle
- Future proof architecture that supports the most advanced ML data types and operators
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Future-proof IP for training and inference with leading performance per watt and per dollar
- RISC-V-based AI IP development for enhanced training and inference.
- Silicon-proven solutions tailored for AI workload optimization.
- Energy-efficient performance with industry-leading Perf/W.
MIPI IP View All
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MIPI C-PHY/D-PHY Combo CSI-2 RX+ IP (6.0Gsps/trio, 4.5Gbps/lane) in TSMC N6
- Dual mode PHY Supports MIPI Alliance Specification D-PHY v2.5 & C-PHY v2.0
- Consists of 1 Clock lane and 4 Data lanes in D-PHY mode
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MIPI CSI-2 controller Receiver v 2.1, Compatible with MIPI C-PHY v1.2 & DPHY v2.1.
- Fully compliant to MIPI standard
- Small footprint
- Code validated with Spyglass
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MIPI D-PHY IP for TSMC (5nm, 6/7nm, 12/16nm, 22nm, 28nm, 40nm)
- Compliant to MIPI Alliance Standard for D-PHY specification Version 2.1, 1.2, 1.1
- Supports standard PHY transceiver compliant to MIPI Specification
- Supports standard PPI interface compliant to MIPI Specification
- Supports synchronous transfer at high speed mode with a bit rate of 80-2500 Mb/s
RISC-V IP View All
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32b/64b RISC-V 5-stage, scalar, in-order, Application Processor. Linux and multi-core capable. Maps upto ARM A-35. Optimal PPA.
- 32/64 Bit RISC-V core
- 5-stage pipeline
- In-order, Single issue
- Multicore Capable (up to 8 cores)
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Dual-issue Linux-capable RISC-V core
- 64-bit RISC-V core
- RVA22 profile
- Linux capable
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High-performance RISC-V CPU
- Fully compliant with the RVA23 RISC-V specification
- Comparable PPA to Arm Neoverse V3 / Cortex-X4
- Standard AMBA CHI.E coherent interface for SoC and chiplet integration
- Co-architected with Veyron E2 for seamless vector, AI acceleration, and big-little style heterogeneous compute configurations